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| 论文题目: | Microstructure and mechanical characteristics of a novel Cu/Cu3Sn joint with Cu/Sn preform |
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| 作者: | ？ Hongyan Xu，Wei Zhang, Xuan Liu, Ju Xu* |
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| 刊物名称: | 22nd International Conference on Electronic Packaging Technology (ICEPT) |
| 年: | 2021 |
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Microstructure and mechanical characteristics of a novel Cu/Cu3Sn joint with Cu/Sn preform